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FPGAKey Technical Documents
Download DatasheetThe XQV1000E-5BG560N FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 µm CMOS process. These advances make Virtex-E FPGAs powerful and flexible alter natives to mask-programmed gate arrays.
Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the XQV1000E-5BG560N delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
Virtex-E Architecture
XQV1000E-5BG560N devices feature a flexible, regular architecture that comprises an array of configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), all interconnected by a rich hierarchy of fast, versatile routing resources. The abundance of routing resources permits the XQV1000E-5BG560N family to accommodate even the largest and most complex designs.
Higher Performance
XQV1000E-5BG560N devices provide better performance than previous generations of FPGAs. Designs can achieve synchronous system clock rates up to 240 MHz including I/O or 622 Mb/s using Source Synchronous data transmission architechtures. Virtex-E XQV1000E-5BG560N I/Os comply fully with 3.3V PCI specifications, and interfaces can be implemented that operate at 33 MHz or 66 MHz. While performance is design-dependent, many designs operate internally at speeds in excess of 133 MHz and can achieve over 311 MHz.
• Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)
• Guaranteed over the full military temperature range (–55°C to +125°C)
• Ceramic and Plastic Packages
• Fast, High-Density 1.8V FPGA Family
- Densities from 600K to 2M system gates
- 130 MHz internal performance (four LUT levels)
- Designed for low-power operation
- PCI compliant 3.3V, 32-bit, 33 MHz
• Highly Flexible SelectIO+ Technology
- Supports 20 high-performance interface standards
- Up to 804 singled-ended I/Os or 344 differential I/O pairs for an aggregate bandwidth of > 100 Gb/s
• Differential Signalling Support
- LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL
- Differential I/O signals can be input, output, or I/O
- Compatible with standard differential devices
- LVPECL and LVDS clock inputs for 300+ MHz clocks
• Proprietary High-Performance SelectLink Technology
- Double Data Rate (DDR) to Virtex-E link
- Web-based HDL generation methodology
• Sophisticated SelectRAM+ Memory Hierarchy
- 600 Kb of internal configurable distributed RAM
- Up to 640 Kb of synchronous internal block RAM
- Dual port block RAM capability
- Memory bandwidth up to 1.66 Tb/s (equivalent bandwidth of over 100 RAMBUS channels)
- Designed for high-performance Interfaces to External Memories
- 200 MHz ZBT* SRAMs
- 200 Mb/s DDR SDRAMs
- Supported by free Synthesizable reference design
• High-Performance Built-In Clock Management Circuitry
- Eight fully digital Delay-Locked Loops (DLLs)
- Digitally-Synthesized 50% duty cycle for Double Data Rate (DDR) Applications
- Clock Multiply and Divide
- Zero-delay conversion of high-speed LVPECL/LVDS clocks to any I/O standard
• Flexible Architecture Balances Speed and Density
- Dedicated carry logic for high-speed arithmetic
- Dedicated multiplier support
- Cascade chain for wide-input function
- Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
- Internal 3-state bussing
- IEEE 1149.1 boundary-scan logic
- Die-temperature sensor diode
• Supported by Xilinx Foundation and Alliance Series Development Systems
- Further compile time reduction of 50%
- Internet Team Design (ITD) tool ideal for million-plus gate density designs
- Wide selection of PC and workstation platforms
• SRAM-Based In-System Configuration
- Unlimited reprogrammability
• Advanced Packaging Options
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