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Download DatasheetThe Xilinx XQR5VFX130-1CN1752V of Radiation-hardened Virtex-5QV FPGAs are available in the -1 speed grade only.
Virtex-5QV FPGA DC and AC characteristics are specified for military temperatures.
The XQR5VFX130-1CN1752V device provides the compelling set of performance, features, and solutions for the radiation-hardened systems market. Using the second generation Advanced Silicon Modular Block (ASMBL™) column-based architecture, the Virtex-5QV FPGA contains an array of features to address the needs of a wide variety of advanced logic designs and many dedicated system-level blocks, including powerful 36 Kb block RAM and FIFOs, second-generation 25 x 18 DSP slices, SelectIO™ technology with built-in digitally controlled impedance, ChipSync™ source-synchronous interface blocks, enhanced clock management tiles with integrated digital clock managers (DCMs), phase-locked-loop (PLL) clock generators, and advanced configuration options.
Additional features include power-optimized, high-speed serial transceiver blocks for enhanced serial connectivity, PCI Express® compliant integrated Endpoint blocks, and tri-mode Ethernet Media Access Controllers (MACs). These features allow advanced logic designers to build the highest levels of connectivity and performance into their FPGA-based systems. Built on a proven 65-nm copper process technology, the XQR5VFX130-1CN1752V FPGA is a modern programmable alternative to custom ASIC technology.
• The only reprogrammable RH FPGA in the industry
• Highest density RH FPGA
• Product intended for use in Space environment offered in full V-Grade and B-Grade manufacturing and screening
process flows
• The product grades are differentiated via the test flow process only
• High signal-integrity ceramic flip-chip column grid array packaging
• Best-in-class signal and power integrity performance levels achieved with chip capacitors mounted onto the FPGA
substrate connected to the VCCINT, VCCAUX, and VCCO power supply rails
• The same package substrate and chip capacitors are used in the assembly of the B-Grade and V-Grade products.
• Guaranteed operation over full military temperature range (–55°C to +125°C)
• Guaranteed 1 Mrad(Si) total ionizing dose per method 1019
• Guaranteed SEE latch-up immunity to LET >100 MeV per mg-cm2
• Radiation-Hardened By Design (RHBD) technology
• SEU Hardened Configuration Memory Cells and control logic
• Configuration Memory Orbital Upset Rate (GEO): 3.8E-10 errors/bit/day
• Configuration Control Logic Single-Event Functional Interrupt (SEFI) Orbital Upset Frequency (GEO): less than
once every 10,000 years
• SEU and SET Hardened CLB flip-flops
• SEU Hardened IOB flip-flops and DCI control
• Embedded error detection and correction (EDAC) and autonomous writeback for high-performance Block Memory SEU
Mitigation
• Fully characterized for space radiation effects in heavy ion and proton environments
• Most advanced, high-performance, optimal-utilization, FPGA logic
• Real 6-input look-up table (LUT) technology
• Dual 5-LUT option
• Improved reduced-hop routing
• 64-bit distributed RAM option
• SRL32/Dual SRL16 option
• Powerful clock management tile (CMT) clocking
• Digital Clock Manager (DCM) blocks for zero delay buffering, frequency synthesis, and clock phase shifting
• PLL blocks for input jitter filtering, zero delay buffering, frequency synthesis, and phase-matched clock division
• 36 Kb block RAM/FIFOs
• True dual-port RAM blocks
• Enhanced optional programmable FIFO logic
• Programmable
- True dual-port widths up to x36
- Simple dual-port widths up to x72
• Built-in optional error-correction circuitry
• Optionally program each block as two independent 18 Kb blocks
• High-performance parallel SelectIO technology
• 1.2 to 3.3V I/O operation
• Source-synchronous interfacing using ChipSync technology
• Digitally controlled impedance (DCI) active termination
• Flexible fine-grained I/O banking
• High-speed memory interface support
• Advanced DSP48E slices
• 25 x 18, twos complement, multiplication
• Optional adder, subtracter, and accumulator
• Optional pipelining
• Optional bitwise logical functionality
• Dedicated cascade connections
• Flexible configuration options
• SPI and Parallel flash interface
• Multi-bitstream support with dedicated fallback reconfiguration logic
• Auto bus width detection capability
• Off-chip thermal monitoring capability
• Integrated Endpoint blocks for PCI Express
• Compliant with the PCI Express Base Specification v1.1
• x1, x4, or x8 lane support per block
• Works in conjunction with RocketIO transceivers
• Tri-mode 10/100/1000 Mb/s Ethernet MACs
• RocketIO GTX transceivers can be used as PHY or connect to external PHY using many programmable Media
Independent Interface (MII) options
• RocketIO GTX transceivers 150 Mb/s to 4.25 Gb/s
• 65 nm copper CMOS process technology
• 1.0V core voltage
Radiation-Hardness Assurance
The radiation-hardened, space-grade Virtex-5QV FPGAs are guaranteed for total ionizing dose (TID) life and single-event
latch-up (SEL) immunity. Extensive single-event upset (SEU) characterization is performed and reported by the Xilinx
Radiation Test Consortium (XRTC).
Total Ionizing Dose
Each wafer lot is sampled and tested per Method 1019 to assure that device performance meets or exceeds the guaranteed
DC electrical specification requirements, as well as AC and timing parameters at maximum guaranteed total dose levels.
Single-Event Latch-Up
The radiation-hardened Virtex-5QV FPGA technology incorporates a thin epitaxial layer in the wafer manufacturing process
for latch-up immunity assurance. The qualified mask set is verified in a heavy ion environment under vacuum, and tested at
maximum VCC and maximum operating temperature, to a fluence exceeding 1E8 particles/cm2.
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