XCV200E-8FG256C of Xilinx Virtex-E 1.8V FPGAs

XCV200E-8FG256C FPGAs Overview

General Description

The Virtex-E FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. These advances make Virtex-E FPGAs powerful and flexible alternatives to mask-programmed gate arrays.

Building on experience gained from Virtex FPGAs, the Virtex-E family is an evolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the Virtex-E family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.

Features

• Fast, High-Density 1.8 V FPGA Family

- Densities from 58 k to 4 M system gates

- 130 MHz internal performance (four LUT levels)

- Designed for low-power operation

- PCI compliant 3.3 V, 32/64-bit, 33/ 66-MHz

• Highly Flexible SelectI/O+™ Technology

- Supports 20 high-performance interface standards

- Up to 804 singled-ended I/Os or 344 differential I/O pairs for an aggregate bandwidth of > 100 Gb/s

• Differential Signalling Support

- LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL

- Differential I/O signals can be input, output, or I/O - Compatible with standard differential devices

- LVPECL and LVDS clock inputs for 300+ MHz clocks

• Proprietary High-Performance SelectLink™ Technology

- Double Data Rate (DDR) to Virtex-E link

- Web-based HDL generation methodology

• Sophisticated SelectRAM+™ Memory Hierarchy

- 1 Mb of internal configurable distributed RAM

- Up to 832 Kb of synchronous internal block RAM

- True Dual-Port BlockRAM capability

- Memory bandwidth up to 1.66 Tb/s (equivalent bandwidth of over 100 RAMBUS channels)

- Designed for high-performance Interfaces to External Memories

- 200 MHz ZBT* SRAMs - 200 Mb/s DDR SDRAMs

- Supported by free Synthesizable reference design

• High-Performance Built-In Clock Management Circuitry

- Eight fully digital Delay-Locked Loops (DLLs)

- Digitally-Synthesized 50% duty cycle for Double Data Rate (DDR) Applications

- Clock Multiply and Divide - Zero-delay conversion of high-speed LVPECL/LVDS clocks to any I/O standard

• Flexible Architecture Balances Speed and Density

- Dedicated carry logic for high-speed arithmetic - Dedicated multiplier support

- Cascade chain for wide-input function

- Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset

- Internal 3-state bussing

- IEEE 1149.1 boundary-scan logic

- Die-temperature sensor diode

• Supported by Xilinx Foundation™ and Alliance Series™ Development Systems

- Further compile time reduction of 50%

- Internet Team Design (ITD) tool ideal for million-plus gate density designs

- Wide selection of PC and workstation platforms

• SRAM-Based In

-System Configuration

- Unlimited re-programmability

• Advanced Packaging Options

- 0.8 mm Chip-scale

- 1.0 mm BGA

- 1.27 mm BGA

- HQ/PQ

• 0.18 μm 6-Layer Metal Process

• 100% Factory Tested

The Xilinx Socle de fusible series XCV200E-8FG256C is Virtex-E 1.8 V Field Programmable Gate Arrays, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at FPGAkey.com, and you can also search for other FPGAs products.

Features

RF Data Converter Subsystem Overview

Most Zynq UltraScale+ RFSoCs include an RF data converter subsystem, which contains multiple radio frequency analog to digital converters (RF-ADCs) and multiple radio frequency digital to analog converters (RF-DACs). The high-precision, high-speed, power efficient RF-ADCs and RF-DACs can be individually configured for real data or can be configured in pairs for real and imaginary I/Q data.

Soft Decision Forward Error Correction (SD-FEC) Overview

Some Zynq UltraScale+ RFSoCs include highly flexible soft-decision FEC blocks for decoding and encoding data as a means to control errors in data transmission over unreliable or noisy communication channels. The SD-FEC blocks support low-density parity check (LDPC) decode/encode and Turbo decode for use in 5G wireless, backhaul, DOCSIS, and LTE applications.

Processing System Overview

Zynq UltraScale+ MPSoCs and RFSoCs feature dual and quad core variants of the Arm Cortex-A53 (APU) with dual-core Arm Cortex-R5F (RPU) processing system (PS). Some devices also include a dedicated Arm Mali-400 MP2 graphics processing unit (GPU).

FAQ

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
In FPGA/CPLD design tools, Xilinx's Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Where can I purchase Xilinx XCV200E Development Boards, Evaluation Boards, or Virtex-E 1.8V FPGAs Starter Kit? also provide technical information?
FPGAkey does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How to obtain XCV200E-8FG256C technical support documents?
Enter the "XCV200E-8FG256C" keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
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Application Field

Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment

XCV200E-8FG256C Specifications

Specification	Value
Number of LABs/CLBs	1176
Number of Logic Elements/Cells	5292
Total RAM Bits	114688
Number of I/O	176
Number of Gates	306393
Voltage - Supply	1.71V ~ 1.89V
Mounting Type	Surface Mount
Operating Temperature	0℃ ~ 85℃ (TJ)
Package / Case	256-BGA
Supplier Device Package	256-FBGA (17x17)