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Download DatasheetThe XCV1600E-8BG560C delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process.
the XCV1600E-8BG560C delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
The Xilinx Connecteurs&adapteurs series XCV1600E-8BG560C is Asy,Grounding Clip,6mm² Solid, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at FPGAkey.com, and you can also search for other FPGAs products.RF Data Converter Subsystem Overview
Most Zynq UltraScale+ RFSoCs include an RF data converter subsystem, which contains multiple radio frequency analog to digital converters (RF-ADCs) and multiple radio frequency digital to analog converters (RF-DACs). The high-precision, high-speed, power efficient RF-ADCs and RF-DACs can be individually configured for real data or can be configured in pairs for real and imaginary I/Q data.
Soft Decision Forward Error Correction (SD-FEC) Overview
Some Zynq UltraScale+ RFSoCs include highly flexible soft-decision FEC blocks for decoding and encoding data as a means to control errors in data transmission over unreliable or noisy communication channels. The SD-FEC blocks support low-density parity check (LDPC) decode/encode and Turbo decode for use in 5G wireless, backhaul, DOCSIS, and LTE applications.
Processing System Overview
Zynq UltraScale+ MPSoCs and RFSoCs feature dual and quad core variants of the Arm Cortex-A53 (APU) with dual-core Arm Cortex-R5F (RPU) processing system (PS). Some devices also include a dedicated Arm Mali-400 MP2 graphics processing unit (GPU).
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| Specification | Value |
|---|---|
| Number of LABs/CLBs | 7776 |
| Number of Logic Elements/Cells | 34992 |
| Total RAM Bits | 589824 |
| Number of I/O | 404 |
| Number of Gates | 2188742 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0℃ ~ 85℃ (TJ) |
| Package / Case | 560-LBGA Exposed Pad, Metal |
| Supplier Device Package | 560-MBGA (42.5x42.5) |
FPGA Virtex-E Family 419.904K Gates 34992 Cells 400MHz 0.18um Technology 1.8V 900-Pin FBGA
FPGA Virtex-E Family 419.904K Gates 34992 Cells 400MHz 0.18um Technology 1.8V 900-Pin FBGA
FPGA Virtex-E Family 419.904K Gates 34992 Cells 416MHz 0.18um Technology 1.8V 560-Pin Metal BGA
FPGA Virtex-E Family 419.904K Gates 34992 Cells 416MHz 0.18um Technology 1.8V 560-Pin Metal BGA
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