$9464.850 - $10516.500 | 1 Pieces(Min. Order)
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FPGAKey Technical Documents
Download DatasheetXilinx XC7VH580T-2FLG1931C FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VH580T-2FLG1931C FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Full-range extended temperature testing
Mask set control
Fully leaded (Pb) content
Ruggedized packaging
Long-term availability
Anti-counterfeiting features
4th Generation Information Assurance and Anti-tamper support
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 11.3 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Number of LABs/CLBs | 45350 |
Number of Logic Elements/Cells | 580480 |
Total RAM Bits | 34652160 |
Number of I/O | 600 |
Voltage - Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | 0℃ ~ 85℃ (TJ) |
Supplier Device Package | 1931-FCBGA (45x45) |
1+ $10516.5000
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