Xilinx 7 series XC7A200T-2SBG484I FPGAs families complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7A200T-2SBG484I FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.The Xilinx FPGAs (Field Programmable Gate Array) series XC7A200T-2SBG484I is FPGA, Artix-7, MMCM, PLL, 285 I/O's, 628 MHz, 215360 Cells, 950 mV to 1.05 V, FCBGA-484, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at FPGAkey.com, and you can also search for other FPGAs products.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
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Number of LABs/CLBs
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Voltage - Supply
0.95V ~ 1.05V
-40℃ ~ 100℃ (TJ)
Package / Case
Supplier Device Package