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Download DatasheetThe XC6VLX195T-3FF784C FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Xilinx XC6VLX195T-3FF784C contain many builtin system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGAbased systems. Built on a 40 nm state-of-the-art copper process technology, XC6VLX195T-3FF784C FPGAs are a programmable alternative to custom ASIC technology. offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
The Xilinx Embedded - FPGAs (Field Programmable Gate Array) series XC6VLX195T-3FF784C is Virtex-6 LXT FPGA 400 I/O 784FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at FPGAkey.com, and you can also search for other FPGAs products.Three sub-families:
Virtex-6 LXT FPGAs: High-performance logic with advanced serial connectivity
Virtex-6 SXT FPGAs: Highest signal processing capability with advanced serial connectivity
Virtex-6 HXT FPGAs: Highest bandwidth serial connectivity
Compatibility across sub-families
LXT and SXT devices are footprint compatible in the same package
Advanced, high-performance FPGA Logic
Dual-port widths up to 36 bits
Simple dual-port widths up to 72 bits
Dual-port RAM blocks
Programmable
Enhanced programmable FIFO logic
Built-in optional error-correction circuitry
Optionally use each block as two independent 18 Kb blocks
High-performance parallel SelectIO technology
1.2 to 2.5V I/O operation
Source-synchronous interfacing using ChipSync technology
Digitally controlled impedance (DCI) active termination
Flexible fine-grained I/O banking
High-speed memory interface support with integrated write-leveling capability
Advanced DSP48E1 slices
Flexible configuration options
SPI and Parallel Flash interface
Multi-bitstream support with dedicated fallback reconfiguration logic
Automatic bus width detection
System Monitor capability on all devices
On-chip/off-chip thermal and supply voltage monitoring
JTAG access to all monitored quantities
Integrated interface blocks for PCI Express designs
Compliant to the PCI Express Base Specification 2.0
Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with GTX transceivers
Endpoint and Root Port capable
X1, x2, x4, or x8 lane support per block
GTX transceivers: up to 6.6 Gb/s
Data rates below 480 Mb/s supported by oversampling in FPGA logic.
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
Integrated 10/100/1000 Mb/s Ethernet MAC block
40 nm copper CMOS process technology
1.0V core voltage (-1, -2, -3 speed grades only)
Lower-power 0.9V core voltage option (-1L speed grade only)
High signal-integrity flip-chip packaging available in standard or Pb-free package options
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Number of LABs/CLBs | 15600 |
Number of Logic Elements/Cells | 199680 |
Total RAM Bits | 12681216 |
Number of I/O | 400 |
Voltage - Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 784-BBGA, FCBGA |
Supplier Device Package | 784-FCBGA (29x29) |
36+ $9725.3721
1+ $3780.4183
1+ $3,868.1700
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