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FPGAKey Technical Documents
Download DatasheetThe XC6VCX240T-1FF1156C FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Xilinx XC6VCX240T-1FF1156C contain many builtin system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGAbased systems. Built on a 40 nm state-of-the-art copper process technology, XC6VCX240T-1FF1156C FPGAs are a programmable alternative to custom ASIC technology. offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
Advanced, high-performance FPGA Logic
Real 6-input look-up table (LUT) technology
Dual LUT5 (5-input LUT) option
LUT/dual flip-flop pair for applications requiring rich register mix
Improved routing efficiency
64-bit (or two 32-bit) distributed LUT RAM option per 6-input LUT
SRL32/dual SRL16 with registered outputs option
Powerful mixed-mode clock managers (MMCM)
MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division
36-Kb block RAM/FIFOs
High-performance parallel SelectIO technology
Advanced DSP48E1 slices
Flexible configuration options
System Monitor capability on all devices
On-chip/off-chip thermal and supply voltage monitoring
JTAG access to all monitored quantities
Integrated interface blocks for PCI Express designs
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
Integrated 10/100/1000 Mb/s Ethernet MAC block
40 nm copper CMOS process technology
1.0V core voltage (-1, -2, -3 speed grades only)
Lower-power 0.9V core voltage option (-1L speed grade only)
High signal-integrity flip-chip packaging available in standard or Pb-free package options
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
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