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FPGAKey Technical Documents
Download DatasheetUsing the second generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the XC5VLX330-2FFG1760I contains five distinct platforms (sub-families), the most choice offered by any FPGA family. Each platform contains a different ratio of features to address the needs of a wide variety of advanced logic designs. In addition to the most advanced, high-performance logic fabric, XC5VLX330-2FFG1760I FPGAs contain many hard-IP system level blocks, including powerful 36-Kbit block RAM/FIFOs, second generation 25 x 18 DSP slices, SelectIO technology with built-in digitally-controlled impedance, ChipSync source-synchronous interface blocks, system monitor functionality,
Cross-platform compatibility
LXT, SXT, and FXT devices are footprint compatible in the same package using adjustable voltage regulators
Most advanced, high-performance, optimal-utilization, FPGA fabric
Real 6-input look-up table (LUT) technology
Dual 5-LUT option
Improved reduced-hop routing
64-bit distributed RAM option
SRL32/Dual SRL16 option
Powerful clock management tile (CMT) clocking
36-Kbit block RAM/FIFOs
High-performance parallel SelectIO technology
1.2 to 3.3V I/O Operation
Source-synchronous interfacing using ChipSync technology
Digitally-controlled impedance (DCI) active termination
Flexible fine-grained I/O banking
High-speed memory interface support
Advanced DSP48E slices
Flexible configuration options
System Monitoring capability on all devices
On-chip/Off-chip thermal monitoring
On-chip/Off-chip power supply monitoring
JTAG access to all monitored quantities
Integrated Endpoint blocks for PCI Express Designs
RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s
TXT and FXT Platforms
PowerPC 440 Microprocessors
FXT Platform only
RISC architecture
7-stage pipeline
32-Kbyte instruction and data caches included
Optimized processor interface structure (crossbar)
65-nm copper CMOS process technology
1.0V core voltage
High signal-integrity flip-chip packaging available in standard or Pb-free package options
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
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