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FPGAKey Technical Documents
Download DatasheetThe XA7Z020-1CLG400Q offers the flexibility and scalability of an FPGA, while providing the performance, power, and ease of use typically associated with ASICs and ASSPs.While each device in the XA Zynq-7000 family contains the same PS, the PL and I/O resources vary between the devices.
The XA XA7Z020-1CLG400Q architecture enables implementation of custom logic in the PL and custom software in the PS. It allows for the realization of unique and differentiated system functions. The integration of the PS with the PL allows levels of performance that two-chip solutions (e.g., an ASSP with an FPGA) cannot match due to their limited I/O bandwidth, latency, and power budgets.
Xilinx offers a large number of soft IP for the XA XA7Z020-1CLG400Q . Stand-alone and Linux device drivers are available for the peripherals in the PS and the PL. The award-winning ISE Design Suite: System Edition development environment enables a rapid product development for software, hardware, and systems engineers. Adoption of the ARM-based PS also brings a broad range of third-party tools and IP providers in combination with Xilinx’s existing PL ecosystem. The inclusion of an application processor enables high-level operating system support。
The XA7Z020-1CLG400Q integrate a feature-rich dual-core ARM Cortex-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device.
The Xilinx Embedded - System On Chip (SoC) series XA7Z020-1CLG400Q is IC SOC CORTEX-A9 667MHZ 400BGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at FPGAkey.com, and you can also search for other FPGAs products.32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)
512 KB 8-way set-associative Level 2 cache (shared between the CPUs)
Byte-parity support
On-Chip Memory
On-chip boot ROM
256 KB on-chip RAM (OCM)
Byte-parity support
External Memory Interfaces
Multiprotocol dynamic memory controller
16-bit or 32-bit interfaces to DDR3L, DDR3, DDR2, or LPDDR2 memories
ECC support in 16-bit mode
Scatter-gather DMA capability
Recognition of 1588 rev. 2 PTP frames
GMII and RGMII interfaces
Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints
USB 2.0 compliant device IP core
On-the-go, high-speed, full-speed, and low-speed modes support
Intel EHCI compliant USB host
8-bit ULPI external PHY interface
Two full CAN 2.0B compliant CAN bus interfaces
CAN 2.0-A and CAN 2.0-B and ISO 118981-1 standard compliant
Q-Grade: Tj = –40°C to +125°C
Automotive Standards
Up to 4 receivers and transmitters
Supports up to 6.6 Gb/s data rates
PCI Express Block
Root Complex and Endpoint configurations
Supports up to Gen2 speeds
Supports up to 4 lanes
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Architecture | MCU, FPGA |
Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Artix?-7 FPGA, 85K Logic Cells |
Operating Temperature | -40℃ ~ 125℃ (TJ) |
Package / Case | 400-LFBGA, CSPBGA |
Supplier Device Package | 400-CSPBGA (17x17) |
90+ $397.0297
1+ $175.663
1+ $149.8000
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