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Download DatasheetXilinx XA7A50T-2CPG236I (Automotive) FPGAs are optimized for the lowest cost and power with small form-factor packaging for high-volume automotive applications. Designers can leverage more logic per watt compared to the Spartan-6 family.
Built on a state-of-the-art high-performance/low-power (HPL) 28 nm high-k metal gate (HKMG) process technology, XA XA7A50T-2CPG236I FPGAs redefine low-cost alternatives with more logic per watt. Unparalleled increase in system performance with 52 Gb/s I/O bandwidth, 100,000 logic cell capacity, 264 GMAC/s DSP, and flexible built-in DDR3 memory interfaces enable a new class of high-throughput, low-cost automotive applications. XA Artix-7 XA7A50T-2CPG236I FPGAs also offer many high-end features, such as integrated advanced Analog Mixed Signal (AMS) technology. Analog becomes the next level of integration through the seamless implementation of independent dual 12-bit, 1 MSPS, 17-channel analog-to-digital converters. Most importantly, XA Artix-7 FPGAs proudly meet the high standards of the automotive grade with a maximum temperature of 125°C.
The Xilinx Embedded - FPGAs (Field Programmable Gate Array) series XA7A50T-2CPG236I is FPGA Artix-7 Family 52160 Cells 28nm Technology 1V 236Pin CPG, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at FPGAkey.com, and you can also search for other FPGAs products.Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
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Medical Equipment
Specification | Value |
---|---|
Number of LABs/CLBs | 4075 |
Number of Logic Elements/Cells | 52160 |
Total RAM Bits | 2764800 |
Number of I/O | 106 |
Voltage - Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 238-LFBGA, CSPBGA |
Supplier Device Package | 236-CSBGA (10x10) |
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