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Download DatasheetThe Xilinx Automotive (XA) Spartan-6 family of XA6SLX75T-3FGG484Q FPGAs provides leading system integration capabilities with the lowest total cost for highvolume automotive applications. The ten-member family delivers expanded densities ranging from 3,840 to 101,261 logic cells and faster, more comprehensive connectivity. Built on a mature 45 nm low-power copper process technology that delivers the optimal balance of cost, power, and performance, the XA6SLX75T-3FGG484Q offers a new, more efficient, dual-register 6-input look-up table (LUT) logic and a rich selection of built-in system-level blocks. These include 18 Kb (2 x 9 Kb) block RAMs, second generation DSP48A1 slices, SDRAM memory controllers, enhanced mixed-mode clock management blocks, SelectIO technology, power-optimized high-speed serial transceiver blocks, PCI Express compatible Endpoint blocks, advanced system-level power management modes, auto-detect configuration options, and enhanced IP security with AES and Device DNA protection. These features provide a low-cost programmable alternative to custom ASIC products with unprecedented ease of use.
XA6SLX75T-3FGG484Q FPGAs offer the best solution for flexible and scalable high-volume logic designs, high-bandwidth parallel DSP processing designs, and cost-sensitive applications where multiple interfacing standards are required. XA SpartanXA6SLX75T-3FGG484Q are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components that enable designers to focus on innovation as soon as their development cycle begins
The Xilinx Embedded - FPGAs (Field Programmable Gate Array) series XA6SLX75T-3FGG484Q is FPGA XA Spartan-6 Family 74637 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at FPGAkey.com, and you can also search for other FPGAs products.• I-Grade: Tj = –40°C to +100°C
• Q-Grade: Tj = –40°C to +125°C
• Automotive Standards:
• Xilinx is ISO-TS16949 compliant
• AEC-Q100 qualification
• Production Part Approval Process (PPAP) documentation
• Beyond AEC-Q100 qualification is available upon request
• Designed for low cost
• Multiple efficient integrated blocks
• Optimized selection of I/O standards
• Staggered pads
• High-volume plastic wire-bonded packages
• Low static and dynamic power
• 45 nm process optimized for cost and low power
• Hibernate power-down mode for zero power
• Pipelining and cascading capability
• Pre-adder to assist filter applications
• Integrated Memory Controller blocks
• DDR, DDR2, DDR3, and LPDDR support
• Data rates up to 800 Mb/s
• 2-pin auto-detect configuration
• Broad third-party SPI (up to x4) and NOR flash support
• MultiBoot support for remote upgrade with multiple
bitstreams, using watchdog protection
• Enhanced security for design protection
• Unique Device DNA identifier for design authentication
• AES bitstream encryption in the XA6SLX75, XA6SLX75T, and XA6SLX100 devices
• Integrated Endpoint block for PCI Express designs (LXT)
• Low-cost PCI technology support compatible with the 33 MHz, 32- and 64-bit specification.
• Faster embedded processing with enhanced, low cost, MicroBlaze 32-bit soft processor
• Industry-leading IP and reference designs
• Strong automotive-specific third-party ecosystem with IP, development boards, and design services
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Specification | Value |
---|---|
Number of LABs/CLBs | 5831 |
Number of Logic Elements/Cells | 74637 |
Total RAM Bits | 3170304 |
Number of I/O | 268 |
Voltage - Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 125℃ (TJ) |
Package / Case | 484-BBGA |
Supplier Device Package | 484-FBGA (23x23) |
1+ $198.9000
10+ $197.3700
30+ $195.8400
50+ $192.7800
100+ $189.7200
2+ $233.2401
1+ $238.6700
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