Virtex UltraScale+™ devices provide the highest performance and integration capabilities in a 14nm/16nm FinFET node. Xilinx 3rd generation 3D ICs use stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s law and deliver the highest signal processing and serial I/O bandwidth to satisfy the most demanding design requirements. It also provides registered inter-die routing lines enabling >600 MHz operation, with abundant and flexible clocking to deliver a virtual monolithic design experience.
As the industry's most capable FPGA family, the devices are ideal for compute-intensive applications ranging from 1+Tb/s networking, machine learning, to radar/early-warning systems.
The highest transceiver bandwidth, highest DSP count, and highest on-chip and in-package memory available in the UltraScale architecture. Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.