In an integrated circuit, a die is a small piece of semiconductor material on which a given functional circuit is fabricated.
Generally, integrated circuits are produced in large quantities on a single wafer of electronic grade silicon (EGS) or other semiconductors (eg GaAs) through processes such as photolithography. The wafer is cut (cut into small pieces), and each piece contains a copy of the circuit, and each of these parts is called a die.
FPGA XC5200 Family 16K Gates 1296 Cells 83MHz 0.5um Technology 5V 240-Pin PQFP
FPGA Spartan-IIE Family 50K Gates 1728 Cells 357MHz 0.15um Technology 1.8V 144-Pin TQFP
FPGA Spartan-IIE Family 50K Gates 1728 Cells 400MHz 0.15um Technology 1.8V 144-Pin TQFP
FPGA Spartan-3E Family 500K Gates 10476 Cells 657MHz 90nm Technology 1.2V 132-Pin CSBGA
Xilinx BGA56
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