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BGA

Ball grid array packaging (English: BGA, Ball Grid Array, hereinafter referred to as BGA) technology is a surface-mount packaging technology applied to integrated circuits, this technology is commonly used to permanently fix devices such as microprocessors. The BGA package can provide more pins than other devices such as Dual in-line package or Quad Flat Package. The bottom surface of the entire device can be used as pins Instead of using only the surroundings, it can also have a shorter average wire length than the package type defined around the surroundings to have better high-speed performance.

Devices that solder BGA packages require precise control and are usually completed by factory equipment with automated procedures. The BGA package device is not suitable for the socket fixing method.

Narrative

BGA packaging technology is improved from pin grid array (PGA). It is a packaging method in which a surface is covered (or partially covered) with pins arranged in a grid pattern, which is in operation. The electronic signal can be transmitted from the integrated circuit to the printed circuit board (printed circuit board, hereinafter referred to as PCB). Under the BGA package, the pins at the bottom of the package are replaced by solder balls, each of which was originally fixed by a small solder ball. These solder balls can be configured manually or through automated machines, and they can be positioned with flux. When the device is fixed on the PCB with surface mount soldering technology, the arrangement of the bottom solder balls exactly corresponds to the position of the copper foil on the board. The production line then heats it up, either in a reflow oven or infrared oven, to dissolve the solder balls. Surface tension causes the molten solder balls to support the package points and align to the circuit board. At the correct spacing distance, when the solder balls are cooled and fixed, the solder joints formed can connect the device and the PCB.

Advantage

high density

BGA packaging technology is a solution derived from the difficulty of packaging that must be reduced when producing integrated circuits with hundreds of pins. Pinned grid array (Pinned grid array) and dual in-line package (Dual in-line package) surface mount soldering (small plastic integrated circuit; small-outline integrated circuit; SOIC) package production, due to the need to join The more pins and the gap between each other must be reduced, which leads to difficulties in the soldering process. As package pins get closer to each other, the risk of accidentally bridging to adjacent pins during soldering increases. BGA packaging technology has no such problems under the welding implemented in the factory.

Thermal conductivity

Another advantage of BGA packaging technology over other packaging technologies such as discrete pins (such as package technology with pins) is that it can have a lower thermal impedance between the package and the PCB. This allows the heat energy generated by the integrated circuit in the package to be more easily conducted to the PCB, preventing the chip from overheating.

Low inductance pins

Shorter conductors mean that unnecessary inductance can be reduced. This characteristic can cause unnecessary signal distortion in high-speed electronic circuits. BGA packaging technology, the distance between the package and the PCB is very short, with low inductance pins, compared with the pin device can have more excellent electronic characteristics.

Disadvantages

Non-extensible contacts

One of the disadvantages of BGA packages is that solder balls cannot stretch like long pins, so they have no material stiffness in physical properties. All surface-mount soldering devices, due to the difference in thermal expansion coefficient between the PCB substrate and the BGA package, are bent (thermal stress), or stretched and vibrated (mechanical stress), which may cause the solder joint to break.

The thermal expansion problem can be solved by matching the thermal characteristics of the PCB and the package. Generally, the plasticized BGA device can be closer to the thermal characteristics of the PCB than the ceramic BGA device.

The commonly used RoHS compatible lead-free solder alloy production line also shows the challenges faced by BGA packaging, such as "Head-in-Pillow" and "pad cracking" during the reflow process. cratering) problem, compared with BGA packages containing lead solder, due to the low ductility of RoHS compatible solder, the reliability of some BGA packages is also reduced under extreme environments such as high temperature, high thermal shock and high G force.

For mechanical stress problems, the device can be bonded to the board through a procedure called "Underfilling". This procedure will inject the epoxy mixture under the device after it is soldered to the PCB, effectively BGA device Attach to the PCB. There are several kinds of underfill materials available for application, which can provide different characteristics for various applications and heat conduction needs. Another benefit of underfilling is that it can limit the growth of tin whiskers.

Another solution to the non-ductile contact is to put a "ductile coating" inside the package, which allows the bottom solder ball to move the actual position according to the corresponding position of the package. This technique has become one of the standards for BGA packaged DRAM manufacturers.

Other techniques used to increase packaging reliability at the PCB level include low-ductility PCBs specifically for ceramic BGA (CBGA), interposers introduced between the package and the PCB board, or re-packaged devices, etc. .

Inspection difficulties

After the package is soldered to the location, it becomes difficult to find the defects during soldering. In order to detect the bottom of the solder package, the industry has developed X-ray machines, industrial computer tomography machines, special microscopes, and endoscopes to overcome this problem. If a BGA package is found to have failed soldering, you can remove it on the "rework station" (commonly known as rework station), which is a fixture equipped with an infrared lamp (or hot air fan), as well as a thermocouple and vacuum device In order to absorb the package. The BGA package can replace another new, heavy industry (or "removal of tin and plant ball", English reballing) and re-installed on the circuit board.

Because the BGA inspection method of visual X-rays is expensive, the circuit test method is often used instead. The common boundary scan test method can be tested through the IEEE 1149.1 JTAG interface connection.

Difficulties when developing circuits

In the development stage, it is not practical to solder the BGA device to a fixed point. Usually, the socket is used first, although this is relatively unstable. There are usually two common sockets: the more reliable type has spring pins, which can cling to the solder balls below, but it is not allowed to use BGA devices with the solder balls removed, because the spring pins may not be long enough.

The unreliable type is a type called "ZIF slot" (Zero Insertion Force), which has spring clamps to hold the solder ball. But this is not easy to succeed, especially when the solder ball is too small.

Equipment cost

To reliably solder the BGA device, expensive equipment is required. Manually soldered BGA devices are very difficult and unreliable, and are usually only used in small and small devices. However, since more and more ICs are only available in lead-free (for example, quad-flat no-leads package) or BGA packages, various DIY methods (heavy industry) have been gradually developed Cheap heating sources can be used, such as hot air guns, household ovens, and flat-bottom electric cookers.

Disadvantages

Non-extensible contacts

One of the disadvantages of BGA packages is that solder balls cannot stretch like long pins, so they have no material stiffness in physical properties. All surface-mount soldering devices, due to the difference in thermal expansion coefficient between the PCB substrate and the BGA package, are bent (thermal stress), or stretched and vibrated (mechanical stress), which may cause the solder joint to break.

The thermal expansion problem can be solved by matching the thermal characteristics of the PCB and the package. Generally, the plasticized BGA device can be closer to the thermal characteristics of the PCB than the ceramic BGA device.

The commonly used RoHS compatible lead-free solder alloy production line also shows the challenges faced by BGA packaging, such as "Head-in-Pillow" and "pad cracking" during the reflow process. cratering) problem, compared with BGA packages containing lead solder, due to the low ductility of RoHS compatible solder, the reliability of some BGA packages is also reduced under extreme environments such as high temperature, high thermal shock and high G force.

For mechanical stress problems, the device can be bonded to the board through a procedure called "Underfilling". This procedure will inject the epoxy mixture under the device after it is soldered to the PCB, effectively BGA device Attach to the PCB. There are several kinds of underfill materials available for application, which can provide different characteristics for various applications and heat conduction needs. Another benefit of underfilling is that it can limit the growth of tin whiskers.

Another solution to the non-ductile contact is to put a "ductile coating" inside the package, which allows the bottom solder ball to move the actual position according to the corresponding position of the package. This technique has become one of the standards for BGA packaged DRAM manufacturers.

Other techniques used to increase packaging reliability at the PCB level include low-ductility PCBs specifically for ceramic BGA (CBGA), interposers introduced between the package and the PCB board, or re-packaged devices, etc. .

Inspection difficulties

After the package is soldered to the location, it becomes difficult to find the defects during soldering. In order to detect the bottom of the solder package, the industry has developed X-ray machines, industrial computer tomography machines, special microscopes, and endoscopes to overcome this problem. If a BGA package is found to have failed soldering, you can remove it on the "rework station" (commonly known as rework station), which is a fixture equipped with an infrared lamp (or hot air fan), as well as a thermocouple and vacuum device In order to absorb the package. The BGA package can replace another new, heavy industry (or "removal of tin and plant ball", English reballing) and re-installed on the circuit board.

Because the BGA inspection method of visual X-rays is expensive, the circuit test method is often used instead. The common boundary scan test method can be tested through the IEEE 1149.1 JTAG interface connection.

Difficulties when developing circuits

In the development stage, it is not practical to solder the BGA device to a fixed point. Usually, the socket is used first, although this is relatively unstable. There are usually two common sockets: the more reliable type has spring pins, which can cling to the solder balls below, but it is not allowed to use BGA devices with the solder balls removed, because the spring pins may not be long enough.

The unreliable type is a type called "ZIF slot" (Zero Insertion Force), which has spring clamps to hold the solder ball. But this is not easy to succeed, especially when the solder ball is too small.

Equipment cost

To reliably solder the BGA device, expensive equipment is required. Manually soldered BGA devices are very difficult and unreliable, and are usually only used in small and small devices. However, since more and more ICs are only available in lead-free (for example, quad-flat no-leads package) or BGA packages, various DIY methods (heavy industry) have been gradually developed Cheap heating sources can be used, such as hot air guns, household ovens, and flat-bottom electric cookers.

Variant

CABGA: Chip Array Ball Grid Array, chip array BGA.

CBGA and PBGA represent that the base material to which BGA is attached is ceramic (Ceramic) or plastic (Plastic).

CTBGA: Thin Chip Array Ball Grid Array, thin chip array BGA.

CVBGA: Very Thin Chip Array Ball Grid Array, ultra-thin chip array BGA.

DSBGA: Die-Size Ball Grid Array, grain size BGA.

FBGA: Fine Ball Grid Array is built on BGA technology. It has thinner contacts, and is mainly used in system-on-a-chip design, which is called FineLine BGA by Altera. It is different from Fortified BGA.

FCmBGA: Flip Chip Molded Ball Grid Array, BGA.

LBGA: Low-profile Ball Grid Array, thin BGA.

LFBGA: Low-profile Fine-pitch Ball Grid Array, thin and fine pitch BGA.

MBGA: Micro Ball Grid Array, micro BGA.

MCM-PBGA: Multi-Chip Module Plastic Ball Grid Array, multi-chip module plastic BGA.

PBGA: Plastic Ball Grid Array, plastic BGA.

SuperBGA (SBGA): Super Ball Grid Array, Super BGA.

TABGA: Tape Array BGA, carrier array BGA.

TBGA: Thin BGA, thin BGA.

TEPBGA: Thermally Enhanced Plastic Ball Grid Array, thermally strengthened plastic BGA.

TFBGA: Thin and Fine Ball Grid Array, thin and fine BGA.

UFBGA or UBGA: Ultra Fine Ball Grid Array, very fine BGA.

In order to easily use the ball grid array device, most BGA packages only have solder balls on the periphery of the package, while the inner square area is left empty.

Intel uses a packaging method called BGA1 on their Pentium II and early Celeron mobile processors. BGA2 is Intel's packaging method for Pentium III and some later Celeron mobile processors. BGA2, also known as FCBGA-479, is used to replace its previous generation BGA1 technology [1].

For example, "Micro Flip Chip Ball Grid Array" (hereinafter referred to as Micro-FCBGA) is Intel's BGA mounting method for mobile processors using flip chip bonding technology. This technology is adopted in the mobile Celeron code-named Coppermine. Micro-FCBGA has 479 solder balls with a diameter of 0.78mm. The processor is attached to the motherboard by soldering solder balls, which is thinner and thinner than the pin grid array slot configuration method, but it cannot be removed.

The 479 solder ball Micro-FCBGA package (almost the same as the 478-pin pluggable Micro-FCPGA package method) is configured with six peripheral 1.27mm pitches (20 solder balls per inch pitch) to form a 26x26 square grid, which has internal The 14x14 area is left blank.

Purchase

The main target users of BGA parts are original equipment manufacturers (OEM, Original Equipment Manufacturer). There is also a certain market among DIY enthusiasts of electronic products, such as the gradually popular hand-made processing. Generally speaking, OEM factories will obtain their component sources from manufacturers or their wholesalers, while amateurs usually obtain BGA parts in the modified product market through electronic component suppliers or wholesalers.

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