CQFP

Details

The four-lead flat package CQFP with a protective ring is one of the plastic QFPs. The leads are covered with a resin protective ring to prevent bending and deformation. Before assembling the LSI on the printed circuit board, cut the lead from the guard ring and make it into a seagull wing shape (L shape). This package has been mass produced by Motorola in the United States. The center distance of the pins is 0.5mm, and the maximum number of pins is about 208.

CQFP is a family of ceramic packages manufactured by dry pressing. The two dry-pressed rectangular or square ceramic pieces (tube bottom and substrate) are printed on the glass used for welding by silk screen printing and then glazed. The glass is then heated and the lead frame is implanted into the bottom of the softened glass, forming a mechanical attachment. Once the semiconductor device is installed and the leads are connected, the bottom of the tube is placed on the top assembly, heated to the melting point of the glass and cooled.

CQFP can have many choices of pin number and form factor. This package is a sealed surface mount package. The ceramic, lead frame and ceramic are sealed together with glass to form the internal chip connection and the external connection with the circuit board. Some packages are designed with a window-type ceramic frame on top of the lead frame to enhance adhesion. Other shells without a window frame must match the cup-shaped ceramic cover. CQFP has a long history and is still used in semiconductor technologies such as digital-to-analog converters, microwaves, logic circuit memories, microcontrollers, and video controllers.

CQFP packaged:

(1).

(2) The number of pins is 14 to 304, and the pitch of the pins is 25 to 50 mils.

(3) Sealed surface mount.

(4).

(5): Gold, dip type: flat, wing-shaped, J-shaped or tin

(6) High thermal conductivity ceramics

(7) Comply with JEDEC standards

(8) A variety of cavity sizes can meet the requirements of most chips.