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PLCC

Chip, EDA, packaging, PLCC introduction.Special pin chip package.

PLCC

Introduction

It is a special pin chip package. It is a type of chip package. The pins of this package are bent inward at the bottom of the chip, so the chip pins are not visible in the top view of the chip. The soldering of this chip uses a reflow soldering process, which requires special soldering equipment. It is also very troublesome to remove the chip during debugging, and it is rarely used now.

PLCC (Plastic Leaded Chip Carrier), a plastic chip carrier with leads. One of the surface-mount packages, the shape is square, 32-pin package, the pins are led out from the four sides of the package, are T-shaped, are plastic products, shape The size is much smaller than the DIP package. The PLCC package is suitable for installing wiring on the PCB using SMT surface mounting technology, and has the advantages of small size and high reliability.

Development

Texas Instruments was first adopted in 64k-bit DRAM and 256kDRAM, and it has been widely used in logic LSI, DLD (or program logic device) and other circuits. The pin center distance is 1.27mm, and the number of pins is from 18 to 84. J-shaped pins are not easy to deform and are easier to operate than QFP, but the visual inspection after welding is more difficult. PLCC is similar to LCC (also known as QFN). Previously, the difference between the two was that the former used plastic and the latter used ceramic. But now There are already J-shaped lead packages made of ceramics and leadless packages made of plastic (marked as plastic LCC, PC LP, P-LCC, etc.), which can no longer be distinguished. For this reason, the Japan Electronic Machinery Industry Association in 1988 Decided to call the package with the J-shaped leads from the four sides as QFJ, and the package with the electrode bumps on the four sides as QFN.

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