Location constraints. Position constraints are used to lock pin locations or to place logic in specific locations in the FPGA.
LOC counts the number and size of files for non-text files such as pictures and Flash; and counts the number of files, text lines, and characters for text files;
Lead-on-chip packaging. One of the LSI packaging technologies is a structure in which the front end of the lead frame is located above the chip, and bump solder joints are made near the center of the chip, and wire stitching is used for electrical connection. Compared with the original structure where the lead frame is arranged near the side of the chip, the chip contained in the same size package has a width of about 1 mm.
LOC counts the number and size of files for non-text files such as pictures and Flash; and counts the number of files, text lines, and characters for text files;
Lead-on-chip packaging. One of the LSI packaging technologies is a structure in which the front end of the lead frame is located above the chip, and bump solder joints are made near the center of the chip, and wire stitching is used for electrical connection. Compared with the original structure where the lead frame is arranged near the side of the chip, the chip contained in the same size package has a width of about 1 mm.
FPGA XC5200 Family 16K Gates 1296 Cells 83MHz 0.5um Technology 5V 144-Pin TQFP EP
FPGA Spartan-IIE Family 600K Gates 15552 Cells 357MHz 0.15um Technology 1.8V 676-Pin FBGA
FPGA Spartan-3E Family 500K Gates 10476 Cells 657MHz 90nm Technology 1.2V 320-Pin FBGA
Xilinx BGA
CPLD CoolRunner -II Family 750 Gates 32 Macro Cells 200MHz 0.18um, CMOS Technology 1.8V 44-Pin VQFP
Support
