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As well as the previously mentioned trends which demand greater prototype adoption, there are trends in device and tool capability which allow us to keep up with that demand. FPGA devices are a classic illustration of Moore’s Law, as we mentioned before. New research will allow the use of multi-die packages and 3D technology to greatly increase the capacity of our leading-edge FPGA devices beyond Moore’s Law. However, this leap in capacity brings new challenges in connectivity. The ratio between internal resource and external IO will continue to cause visibility and connectivity issues for prototyping, accelerating novel solutions for multiplexing and debug tools.
The complexity of creating reliable and flexible FPGA boards using these new devices in ever-shorter project cycles will reduce the proportion of in-house boards compared to commercial boards. In-house boards will still be used for specific needs or to support very large numbers of platforms, or to support a large company in-house standard. However, we shall see most other deigns complete their current migration to ready-made boards, which itself will probably create a healthy and competitive market from which prototypers can select.
The future of FPGAs as the hardware prototyping platform of choice is secure and will be complemented with growing use of virtual prototypes. These will increasingly be combined into hybrid arrangements and we can expect a merging of the two approaches into a more continuous prototyping methodology from system to silicon in the future.
Manufacturer:Xilinx
Product Categories:
Lifecycle:Obsolete -
RoHS: No RoHS
Manufacturer:Xilinx
Product Categories:
Lifecycle:Obsolete -
RoHS: No RoHS
Manufacturer:Xilinx
Product Categories:
Lifecycle:Obsolete -
RoHS:
Manufacturer:Xilinx
Product Categories: FPGAs (Field Programmable Gate Array)
Lifecycle:Obsolete -
RoHS: No RoHS
Manufacturer:Xilinx
Product Categories:
Lifecycle:Obsolete -
RoHS: No RoHS
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