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Home > FPGA Technical Tutorials > Designing with Xilinx FPGAs Using Vivado > Stacked Silicon Interconnect (SSI)

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Stacked Silicon Interconnect (SSI)

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A growing trend in the semiconductor market is to gravitate toward 2.5D and 3D  technologies as a way to extend and improve the growth and integration path that  Moore’s law has paved for more than 50 years. Xilinx has been a forerunner into  this emerging technology entering into this foray in 2011 with the public introduction of the Xilinx XC7V2000T device utilizing four active die on a passive interposer creating not only the largest FPGA of the time but one of the fifi rst commercially  available examples of this new technology. Since the introduction of that device,  several other devices have followed and now are becoming a more mainstream  means to realize large, high-performance devices to address some of the most  demanding FPGA designs. Due to the sheer size and unique construction of these  devices, a new approach to design should be considered in order to facilitate design  entry, implementation, and closure.


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