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FPGAKey Technical Documents
Download DatasheetCrossLinkPlus from Lattice Semiconductor is a programmable video bridging device that supports a variety of protocols and interfaces for mobile image sensors and displays. The device is based on Lattice mobile FPGA 40-nm technology with embedded flash. It is a low power FPGA with small footprint and instant boot up time (< 10 ms).
CrossLinkPlus supports video interfaces including MIPI DPI, MIPI DBI, CMOS camera, and display interfaces, OpenLDI, FPD-Link, FLATLINK, MIPI D-PHY, MIPI CSI-2, MIPI DSI, SLVS200, subLVDS, HiSPi, and more.
Lattice Semiconductor provides many pre-engineered Intellectual Property (IP) modules for CrossLinkPlus. By using these configurable soft core IPs as standardized blocks, you are free to concentrate on the unique aspects of your design, increasing the productivity. The Lattice Diamond design software allows large complex designs to be efficiently implemented using CrossLinkPlus. Synthesis library support for CrossLinkPlus devices is available for popular logic synthesis tools. The Diamond tools use the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the CrossLinkPlus device. The tools extract the timing from the routing and back-annotate it into the design for timing verification.
Interfaces on CrossLinkPlus provide a variety of bridging solutions for smart phone, tablets, wearables, VR, AR, Drone, Smart Home, HMI as well as adjacent ISM markets. The device is capable of supporting high-resolution, high-bandwidth content for mobile cameras and displays at four UHD and beyond.
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Rohs Code | Yes |
Part Life Cycle Code | Active |
Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP |
Package Description | BGA-80 |
Reach Compliance Code | compliant |
Samacsys Manufacturer | Lattice Semiconductor |
JESD-30 Code | S-PBGA-B80 |
Length | 7 mm |
Number of CLBs | 742 |
Number of Inputs | 37 |
Number of Logic Cells | 5936 |
Number of Outputs | 37 |
Number of Terminals | 80 |
Operating Temperature-Max | 100 °C |
Operating Temperature-Min | -40 °C |
Organization | 742 CLBS |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | BGA80,10X10,26 |
Package Shape | SQUARE |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Seated Height-Max | 1.2 mm |
Supply Voltage-Max | 1.26 V |
Supply Voltage-Min | 1.14 V |
Supply Voltage-Nom | 1.2 V |
Surface Mount | YES |
Temperature Grade | INDUSTRIAL |
Terminal Form | BALL |
Terminal Pitch | 0.65 mm |
Terminal Position | BOTTOM |
Width | 7 mm |
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25+ $9.9861
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