LFSCM3GA25EP1-6FN900C

Features

■ High Performance FPGA Fabric

• 15K to 115K four input Look-up Tables (LUT4s)

• 139 to 942 I/Os

• 700MHz global clock; 1GHz edge clocks

■ 4 to 32 High Speed SERDES and flexiPCS (per Device)

• Performance ranging from 600Mbps to 3.8Gbps

• Excellent Rx jitter tolerance (0.8UI at 3.125Gbps)

• Low Tx jitter (0.25UI typical at 3.125Gbps)

• Built-in Pre-emphasis and equalization

• Low power (typically 105mW per channel)

• Embedded Physical Coding Sublayer (PCS) provides pre-engineered implementation for the following standards:

– GbE, XAUI, PCI Express, SONET, Serial RapidIO, 1G Fibre Channel, 2G Fibre Channel

■ 2Gbps High Performance PURESPEED I/O

• Supports the following performance bandwidths

– Differential I/O up to 2Gbps DDR (1GHz Clock)

– Single-ended memory interfaces up to 800Mbps

• 144 Tap programmable Input Delay (INDEL) block on every I/O dynamically aligns data to clock for robust performance

– Dynamic bit Adaptive Input Logic (AIL) monitoring and control circuitry per pin that automatically ensures proper set-up and hold

– Dynamic bus: uses control bus from DLL

– Static per bit

• Electrical standards supported:

– LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL

– SSTL 3/2/18 I, II; HSTL 18/15 I, II

– PCI, PCI-X

– LVDS, Mini-LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS, Hypertransport

• Programmable On Die Termination (ODT)

– Includes Thevenin Equivalent and low power VTT termination options

■ sysCLOCK Network

• Eight analog PLLs per device

– Frequency range from 15MHz to 1GHz

– Spread spectrum support

• 12 DLLs per device with direct control of I/O delay

– Frequency range from 100MHz to 700MHz

• Extensive clocking network

– 700MHz primary and 325 MHz secondary clocks

– 1GHz I/O-connected edge clocks

• Precision Clock Divider

– Phase matched x2 and x4 division of incoming clocks

• Dynamic Clock Select (DCS)

– Glitch free clock MUX

■ Masked Array for Cost Optimization (MACO) Blocks

• On-chip structured ASIC Blocks provide preengineered IP for low power, low cost system level integration

■ High Performance System Bus

• Ties FPGA elements together with a standard bus framework

– Connects to peripheral user interfaces for run-time dynamic configuration

■ System Level Support

• IEEE standard 1149.1 Boundary Scan, plus ispTRACY internal logic analyzer

• IEEE Standard 1532 in-system configuration

• 1.2V and 1.0V operation

• Onboard oscillator for initialization and general use

• Embedded PowerPC microprocessor interface

• Low cost wire-bond and high pin count flip-chip packaging

• Low cost SPI Flash RAM configuration

FAQ

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