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Download Datasheet Higher Logic Density for Increased System Integration
• 17K to 149K LUTs
• 116 to 586 I/Os Embedded SERDES
• 150 Mbps to 3.2 Gbps for Generic 8b10b, 10-bit SERDES, and 8-bit SERDES modes
• Data Rates 230 Mbps to 3.2 Gbps per channel for all other protocols
• Up to 16 channels per device: PCI Express, SONET/SDH, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G and Serial RapidIO
sysDSP
• Fully cascadable slice architecture
• 12 to 160 slices for high performance multiply and accumulate
• Powerful 54-bit ALU operations
• Time Division Multiplexing MAC Sharing
• Rounding and truncation
• Each slice supports
— Half 36x36, two 18x18 or four 9x9 multipliers
— Advanced 18x36 MAC and 18x18 MultiplyMultiply-Accumulate (MMAC) operations
Flexible Memory Resources
• Up to 6.85Mbits sysMEM Embedded Block RAM (EBR)
• 36K to 303K bits distributed RAM
sysCLOCK Analog PLLs and DLLs
• Two DLLs and up to ten PLLs per device
Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
• Dedicated read/write levelling functionality
• Dedicated gearing logic
• Source synchronous standards support
— ADC/DAC, 7:1 LVDS, XGMII
— High Speed ADC/DAC devices
• Dedicated DDR/DDR2/DDR3 memory with DQS support
• Optional Inter-Symbol Interference (ISI) correction on outputs
Programmable sysI/O Buffer Supports Wide Range of Interfaces
• On-chip termination
• Optional equalization filter on inputs
• LVTTL and LVCMOS 33/25/18/15/12
• SSTL 33/25/18/15 I, II
• HSTL15 I and HSTL18 I, II
• PCI and Differential HSTL, SSTL
• LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS
Flexible Device Configuration
• Dedicated bank for configuration I/Os
• SPI boot flash interface
• Dual-boot images supported
• Slave SPI
• TransFR I/O for simple field updates
• Soft Error Detect embedded macro
System Level Support
• IEEE 1149.1 and IEEE 1532 compliant
• Reveal Logic Analyzer
• ORCAstra FPGA configuration utility
• On-chip oscillator for initialization & general use
• 1.2 V core power supply
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Category | Integrated Circuits (ICs) |
Mounting Type | Surface Mount |
Number of I/O | 295 |
Number of LABs/CLBs | 8375 |
Number of Logic Elements/Cells | 67000 |
Operating Temperature | -40掳C ~ 100掳C |
Package / Case | 484-BBGA |
Series | ECP3 |
Standard Package | 60 |
Supplier Device Package | 484-FPBGA (23x23) |
Total RAM Bits | 4526080 |
Voltage - Supply | 1.14 V ~ 1.26 V |
FPGA LatticeECP3 Family 67000 Cells 65nm Technology 1.2V 484-Pin FBGA Tray
FPGA LatticeECP3 Family 67000 Cells 65nm Technology 1.2V 1156-Pin FBGA Tray
FPGA LatticeECP3 Family 67000 Cells 65nm Technology 1.2V 672-Pin FBGA Tray
FPGA LatticeECP3 Family 67000 Cells 65nm Technology 1.2V 672-Pin FBGA Tray
60+ $122.2945
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