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FPGAKey Technical Documents
Download Datasheet■ Flexible Multi-Function Block (MFB) Architecture
• SuperWIDE logic (up to 136 inputs)
• Arithmetic capability
• Single- or Dual-port SRAM
• FIFO
• Ternary CAM
■ sysCLOCK PLL Timing Control
• Multiply and divide between 1 and 32
• Clock shifting capability
• External feedback capability
■ sysIO Interfaces
• LVCMOS 1.8, 2.5, 3.3V
– Programmable impedance
– Hot-socketing
– Flexible bus-maintenance (Pull-up, pulldown, bus-keeper, or none)
– Open drain operation
• SSTL 2, 3 (I & II)
• HSTL (I, III, IV)
• PCI 3.3
• GTL+
• LVDS
• LVPECL
• LVTTL
■ Expanded In-System Programmability (ispXP)
• Instant-on capability
• Single chip convenience
• In-System Programmable via IEEE 1532 Interface
• Infinitely reconfigurable via IEEE 1532 or sysCONFIG microprocessor interface
• Design security
■ High Speed Operation
• 4.0ns pin-to-pin delays, 300MHz fMAX
• Deterministic timing
■ Low Power Consumption
• Typical static power: 20 to 50mA (1.8V), 30 to 60mA (2.5/3.3V)
• 1.8V core for low dynamic power
■ Easy System Integration
• 3.3V (5000MV), 2.5V (5000MB) and 1.8V (5000MC) power supply operation
• 5V tolerant I/O for LVCMOS 3.3 and LVTTL interfaces
• IEEE 1149.1 interface for boundary scan testing
• sysIO quick configuration
• Density migration
• Multiple density and package options
• PQFP and fine pitch BGA packaging
• Lead-free package options
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| Specification | Value |
|---|---|
| Memory Type | EEPROM/SRAM |
| Number of Macrocells | 768 |
| Maximum Operating Frequency | 250 MHz |
| Delay Time | 5 ns |
| Number of Programmable I/Os | 176 |
| Operating Supply Voltage | 3.3 V |
| Maximum Operating Temperature | + 90 C |
| Minimum Operating Temperature | 0 C |
| Package / Case | FPBGA-256-176 |
| Mounting Style | SMD/SMT |
| Number of Product Terms per Macro | 160 |
| Packaging | Tray |
| Factory Pack Quantity | 450 |
| Supply Current | 40 mA |
| Supply Voltage - Max | 3.6 V |
| Supply Voltage - Min | 3 V |
1+ $172.6637
1+ $38.12
1+ $147.9500
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