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Lattice iCE40 Ultra Family

iCE40 Ultra Family

iCE40 Ultra™ family from Lattice Semiconductor is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as smartphones, tablets and hand-held devices. The iCE40 Ultra family includes integrated SPI and I2C blocks to interface with virtually all mobile sensors and application processors. The iCE40 Ultra family also features two on-chip oscillators, 10 kHz and 48 MHz. The LFOSC (10 kHz) is ideal for low power function in always-on applications, while HFOSC (48 MHz) can be used for awaken activities. The iCE40 Ultra family also features DSP functional block to off-load Application Processor to pre-process information sent from the mobile sensors. The embedded RGB PWM IP, with the three 24 mA constant current RGB outputs on the iCE40 Ultra provides all the necessary logic to directly drive the service LED, without the need of external MOSFET or buffer. The 500 mA constant current IR driver output provides a direct interface to external LED for application such as IrDA functions. Users simply implement the modulation logic that meets his needs, and connect the IR driver directly to the LED, without the need of external MOSFET or buffer. This high current IR driver can also be used as Barcode Emulation, sending barcode information to external Barcode Reader. The iCE40 Ultra family of devices are targeting for mobile applications to perform functions such as IrDA, Service LED, Barcode Emulation, GPIO Expander, SDIO Level Shift, and other custom functions. The iCE40 Ultra family features three device densities, from 1100 to 3520 Look Up Tables (LUTs) of logic with programmable I/Os that can be used as either SPI/I2C interface ports or general purpose I/Os. It also has up to 80 kbits of Block RAMs to work with user logic.

Features

 Flexible Logic Architecture

 Three devices with 1100 to 3520 LUTs

 Offered in WLCS, ucfBGA and QFN packages

 Ultra-low Power Devices

 Advanced 40 nm ultra-low power process

 As low as 71 µA standby current typical

 Embedded Memory

 Up to 80 kbits sysMEM™ Embedded BlockRAM

 Two Hardened I2C Interfaces

 Two Hardened SPI Interfaces

 Two On-Chip Oscillators

 Low Frequency Oscillator – 10 kHz

 High Frequency Oscillator – 48 MHz

 24 mA Current Drive RGB LED Outputs

 Three drive outputs in each device

 User selectable sink current up to 24 mA

 500 mA Current Drive IR LED Output

 One IR drive output in each device

 User selectable sink current up to 500 mA

 On-chip DSP

 Signed and unsigned 8-bit or 16-bit functions

 Functions include Multiplier, Accumulator, andMultiply-Accumulate (MAC)

 Flexible On-Chip Clocking

 Eight low skew global signal resource, six canbe directly driven from external pins

 One PLL with dynamic interface per device

 Flexible Device Configuration

 SRAM is configured through:

 Standard SPI Interface

 Internal Nonvolatile ConfigurationMemory (NVCM)

 Ultra-Small Form Factor

 As small as 2.078 mm x 2.078 mm

 Applications

 Smartphones

 Tablets and Consumer Handheld Devices

 Handheld Commercial and Industrial Devices

 Multi Sensor Management Applications

 Sensor Pre-processing and Sensor Fusion

 Always-On Sensor Applications

 USB 3.1 Type C Cable Detect/Power Delivery Applications

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