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FPGAKey Technical Documents
Download DatasheetThe 5CGXFC3B7F23C8N is designed to be an FPGA solution with 208 I/O pins for versatile interfacing with external devices and components. Its 484-Ball Fine-Pitch Ball Grid Array (FBGA) package ensures a compact and reliable form factor suitable for surface mounting on printed circuit boards.
Logic Elements (LEs): The FPGA consists of logic elements, which are the basic building blocks that can be configured to perform various logic functions.
I/O Pins: With 208 I/O (Input/Output) pins, the FPGA provides interfaces for connecting with external devices and components.
Configurability: Being an FPGA, the 5CGXFC3B7F23C8N is highly configurable, allowing users to program and reprogram the device to suit specific application requirements.
484FBGA Package: The package type is 484FBGA (Fine-pitch Ball Grid Array), providing a compact form factor for integration into electronic systems.
Digital Signal Processing (DSP): Suitable for applications requiring high-speed and parallel processing.
Communication Systems: Commonly used in communication systems, including networking equipment.
Embedded Systems: Ideal for embedded applications where flexibility and reprogrammability are essential.
Prototyping: FPGAs are often used for prototyping and testing electronic designs before finalizing the hardware.
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Manufacturer Part # | 5CGXFC3B7F23C8N |
Package/Case | FBGA-484 |
Brand | Intel |
Product Categories | Field Programmable Gate Array (FPGA) |
Logic Elements | Approximately 50,000 |
Embedded Memory | 2,541 Kbits |
Operating Frequency | Up to 300 MHz |
I/O Pins | Approximately 206 |
Voltage Supply | 1.2 V |
Operating Temperature Range | 0°C to +85°C |
Configuration | Internal Flash |
Package Type | FBGA-484 |
Packaging | Tray |
1+ $80.810
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