Intel® Stratix® 10 MX (DRAM System-in-Package) Device Overview

Delivering over 10X higher memory bandwidth compared to discrete DRAM solutions, Intel® Stratix® 10 MX DRAM System-in-Package (SiP) devices meet the memory bandwidth requirements of your next-generation designs. 

Intel Stratix 10 MX devices integrate 3D stacked High-Bandwidth DRAM Memory (HBM2) alongside a high-performance monolithic 14 nm FPGA fabric die, and multiple high-speed transceiver tiles, all inside a single flip-chip FBGA package. 

This new class of devices offers the highest memory bandwidth available in an FPGA, eliminating the memory bandwidth bottlenecks in high-performance systems such as data centers, broadcast, wireline networking, and high-performance computing systems. Intel Stratix 10 MX devices enable you to achieve the highest memory bandwidth and lowest system power, giving you the best bandwidth per watt metric. 

Intel Stratix 10 MX devices feature several groundbreaking innovations such as the new HyperFlex® core architecture, dual mode 57.8 Gbps PAM4 / 28.9 Gbps Non-Return to Zero (NRZ) transceivers, and advanced packaging technology based on Intel’s Embedded Multi-die Interconnect Bridge (EMIB). These devices demonstrate Intel's leadership in high-performance programmable devices and our commitment to deliver the most advanced solutions to your most challenging system problems.