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Download DatasheetHardCopy APEXTM HC20K600FC672ABN devices enable high-density APEX 20KE device technology to be used in high-volume applications where significant cost reduction is desired. HardCopy APEX devices are physically and functionally compatible with APEX 20KC and APEX 20KE devices. They combine the time-to-market advantage, performance, and flexibility of APEX 20KE devices with the ability to move to high-volume, low-cost devices for production. The migration process from an APEX 20KE device to a HardCopy APEX device is fully automated, with designer involvement limited to providing a few Quartus II software-generated output files.
HardCopy APEX devices are manufactured using an 0.18-μm CMOS six-layer-metal
process technology:
■ Preserves functionality of a configured APEX 20KC or APEX 20KE device
■ Pin-compatible with APEX 20KC or APEX 20KE devices
■ Meets or exceeds timing of configured APEX 20KE and APEX 20KC devices
■ Optional emulation of original programmable logic device (PLD) programming sequence
■ High-performance, low-power device
■ MultiCore architecture integrating embedded memory and look-up table (LUT) logic used for register-intensive functions
■ Embedded system blocks (ESBs) used to implement memory functions, including first-in first-out (FIFO) buffers, dual-port RAM, and content-addressable memory (CAM)
■ Customization performed through metallization layers
Artificial Intelligence
5G Technology
Cloud Computing
Consumer Electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Number of Logic Elements/Cells | 24320 |
Total RAM Bits | 311296 |
Number of Gates | 600000 |
Voltage - Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | 0??C ~ 85??C (TJ) |
Package / Case | 652-BGA |
Supplier Device Package | 652-BGA (45x45) |
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